gpu cpu thermal gap pad

Brand Name:Trumony

Place of Origin:Jiangsu，China

...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal...

Brand Name:Ziitek

Model Number:TIF100-66U

Place of Origin:Vietnam

Custom Laptop Hard Drive GPU CPU Thermal Conductive Pad The TIF®100-66U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and ...

Brand Name:ZIITEK

Model Number:TIF1120-30-02US

Place of Origin:China

...Pads for CPU,20 Shore 00 The TIF1120-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0. TIF100-30-02US-Datasheet-REV02.pdf Features > Good thermal...

Brand Name:Ziitek

Model Number:TIF540BS

Place of Origin:China

Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal...

Brand Name:BERGQUIST

Model Number:GP3500ULM

Place of Origin:China

... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and

Brand Name:Laird

Model Number:A18213-XX

Place of Origin:China

Thermal Pad Gap Filler Laird Tflex SF10 10 W/Mk Thermal Conductivity Die Cutting

Brand Name:Fuqiang

Model Number:FQTCS24050801

Place of Origin:China

... Silicone Pad. Featuring superior thermal conductivity and electrical isolation, it ensures efficient cooling for electronic devices. Easy to apply and durable, it's ideal for heat sinks, microprocessors, and more. Improve thermal management with our

Brand Name:KKG

Model Number:12620

Place of Origin:Dongguan

OEM / ODM Laptop GPU CPU Silica Gel Thermally Conductive Pad​ Product Name adhesive backed rubber pad Color Black Hardness 50-70Shore Product Form Rollstock Roll Width 0.3-10mm Shape Custom-made Material NBR,...

Brand Name:XCWY

Model Number:S0006

Place of Origin:Hebei,China

Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad Material Aluminum Alloy,Steel or Customized Color Customized MOQ 1pc Sample Acceptable Certification CE, RoHS, GS, ISO9001 Inspection 100% inspection Tolerance +/-0.1mm ...

Brand Name:LF

Model Number:LF-ET0525

Place of Origin:Guangdong, Mainland China

Aluminum Heat sink thermal Pad for Laptop GPU CPU VGA Chip RAM Heat sink sheet Quick Details: Material: aluminum (stainless steel, Iron, brass) Machining process: stamping machining (punching lathe 40T, five sets) Finishing: Polishing, Silver oxidation, ...

Brand Name:AOK

Model Number:TP

Place of Origin:China

Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~...

Model Number:M-TP300

Place of Origin:China

Product Description: Our Thermal Conductive Silicone Pad is made of silicone, a durable material that can withstand high temperatures and harsh environmental conditions. With a hardness of 45 ShoreC and a tensile strength of 3 MPa, this Thermal Heat Sink ...

Brand Name:Adcol

Model Number:A-gapfill 220

Place of Origin:China

... thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable. Naturally tacky and not

Brand Name:Race

Model Number:GTP010~GTP012

Place of Origin:China

...CPU Thermal Pad is designed with a hardness of Shore 30±5, providing high thermal conductivity and excellent compression properties. It boasts a tensile strength of 0.23MPa, which ensures that it can withstand high temperatures and pressure without losing its shape or effectiveness. This makes it an ideal choice for use in CPU thermal...

Place of Origin:Guangdong, China

Brand Name:OEM

Model Number:xiaowu

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Brand Name:HUITIAN

Model Number:0111

Place of Origin:China

0111 TDS-EN.pdf 0111 is a one-component Silicone Thermal Conductive Grease suitable for gap filling and reducing the temperature of electronic components. Product Features: One-component, white; Wideworkingtemperaturerange; Nontoxic,non-corrosive to PCB...

Categories:CPU Processor

Country/Region:china

... processor cpu support server H100 A100 gpu #detail_decorate_root .magic-0{border-bottom-style:none;border-bottom-color:#fff;font-family:Roboto;font-size:16px;color:#fff;font-style:normal;border-bottom-width:2px;padding-top:8px;padding-bottom:4px}#...

Brand Name:dell

Model Number:PowerEdge R440

Place of Origin:Beijing, China

Original PowerEdge R440 server Silver 4108 Processor 1.8 GHz cpu 1tb HDD 8GB RAM Rack Server Specification Processor Intel® Xeon® Bronze 6136 3.0G, 12C/24T, 24.75M Cache, Turbo, HT (150W) DDR4-2666 Memory 8GB RDIMM, 2666MT/s, Single Rank 16GB RDIMM, 2666MT...

Brand Name:Neardi

Model Number:LPB3399PRO

Place of Origin:Shanghai, China

...GPU ARM Mali-T860MP4 GPU LPB3399Pro Industrial Box PC: High-Performance, Fanless Edge Computing Solution The LPB3399Pro Industrial Box PC, powered by the Rockchip RK3399Pro platform, is a rugged, industrial-grade computing system designed for AI-driven edge applications. Featuring a full-aluminum, fanless design, it efficiently dissipates heat by channeling thermal energy from key components like the CPU...