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| Categories | Semiconductor Substrate |
|---|---|
| Brand Name: | ZMSH |
| Model Number: | Ultra-thick silicon oxide wafer |
| Place of Origin: | China |
| MOQ: | 5 |
| Payment Terms: | T/T |
| Application Areas: | Semiconductor Manufacturing, Microelectronics, Optical Devices, Etc. |
| In-plane and interplane uniformity:: | ±0.5%, |
| Oxide thickness tolerance: | +/- 5% (both Sides) |
| Melting Point: | 1,600° C (2,912° F) |
| Density: | 2533 Kg/m-3 |
| thickness: | 20um、10um-25um |
| Refractive Index: | Approximately 1.44 |
| Coefficient of Expansion: | 0.5 × 10^-6/°C |
| Company Info. |
| SHANGHAI FAMOUS TRADE CO.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
The SIO2 silicon dioxide wafer, vital in semiconductor production, features a thickness ranging from 10μm to 25μm and is available in 6-inch and 8-inch diameters. Primarily serving as an essential insulating layer, it plays a pivotal role in microelectronics, offering high dielectric strength. With a refractive index approximately at 1.4458 at 1550nm, this wafer ensures optimal performance in various applications. Its uniformity and purity make it an ideal choice for optical devices, integrated circuits, and microelectronics. The SIO2 wafer, owing to its exceptional properties, facilitates precise device fabrication processes. Its versatility extends to supporting advancements in technological domains, ensuring reliability and functionality across a spectrum of applications in semiconductor manufacturing and related industries.
Silicon dioxide wafers have wide-ranging applications in the realms of technology and science, playing crucial roles in semiconductor manufacturing, optics, biomedical sciences, and sensor technologies. With advancements in technology and the burgeoning demand, the developmental prospects for SiO2 wafers remain highly promising.
The ongoing quest for smaller, faster, and more energy-efficient electronic devices will continue to propel the evolution of semiconductor manufacturing technology. SiO2 wafers, as a pivotal component within this landscape, are likely to undergo continuous enhancement and refinement through the introduction of novel materials, processes, and designs, catering to the ever-expanding market needs.
In essence, SiO2 wafers continue to hold vast developmental prospects within the semiconductor and microelectronics domains, maintaining their pivotal role across various high-tech industries.
| Parameter | Value |
|---|---|
| Boiling Point | 2,230° C (4,046° F) |
| Orientation | <100><11><110> |
| Oxide thickness tolerance | ± 5% (both Sides) |
| In-plane and interplane uniformity | ±0.5% |
| Refractive index | 550nm Of 1.4458 ± 0.0001 |
| Thickness | 20um,10um-25um |
| Density | 2533 Kg/m-3 |
| Molecular Weight | 60.09 |
| Coefficient of Expansion | 0.5 × 10^-6/°C |
| Melting Point | 1,600° C (2,912° F) |
| Applications | Thin film technology, Silicon oxide wafer, Substrate technology |
ZMSH offers customized services for Semiconductor Substrate. Our Semiconductor Substrate products are made out of the highest quality semiconductor material and silicon oxide wafer. Our Brand Name is ZMSH, and our Model Number is Ultra-thick silicon oxide wafer. Our Place of Origin is China, with a Coefficient of Expansion of 0.5 × 10^-6/°C. We use the Czochralski (CZ) process for wafer growth, and the Orientation is <100><11><110>. Additionally, our In-plane and interplane uniformity is ±0.5%, and the Boiling Point is 2,230° C (4,046° F).
Our company provides technical support and services for Semiconductor Substrate products. Our team of experienced engineers and technicians is available to provide assistance with installation, troubleshooting and maintenance of these products. We provide a range of services from on-site support to remote assistance. We also offer training and seminars to help our customers use the products properly and get the most out of them. We strive to maintain the highest quality standards to ensure our customers receive the best service possible. If you have any questions or concerns, please do not hesitate to contact us.
Packaging and Shipping a Semiconductor Substrate:
Semiconductor substrates must be carefully packaged and shipped to prevent damage and contamination. The substrate should be placed on an antistatic mat, wrapped in an antistatic bag, and encased in a protective bubble wrap. The package should be labeled with a warning label indicating that the contents are sensitive electronic components. The package should then be sealed with tape and placed in a sturdy cardboard box.
The box should be marked with the appropriate shipping information and a "Fragile" label to ensure that the package is handled with care. It should then be placed in a protective shipping container and shipped via a trusted freight carrier.
A: A semiconductor substrate is a thin wafer of material, typically a semiconductor like silicon, on which integrated circuits or other electronic components are built.
A: Our Semiconductor Substrate is ZMSH.
A: The model number of our Semiconductor Substrate is Ultra-thick silicon oxide wafer.
A: Our Semiconductor Substrate is from China.
A: The primary purpose of a Semiconductor Substrate is to provide a foundation to create integrated circuits and other electronic components.
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