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8.5W CPU Cooling Pad Thermal Conductivity Silicone Soft Thermal Pad For Memory Storage Module

Categories Thermal Conductive Pad
Brand Name: ZIITEK
Model Number: TIF7140RUS Series
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 10000/day
Delivery Time: 3-5work days
Packaging Details: 1000pcs/bag
Products name: 8.5W CPU Cooling Pad Thermal Conductivity Silicone Soft Thermal Pad For Memory Storage Module
Thickness: 3.5mmT
Thermal conductivity& Compostion: 8.5W/m-K
Keywords: CPU Cooling Pad
Construction: Ceramic filled silicone elastomer
Specific Gravity: 3.2g/cc
Color: Gray
Continuos Use Temp: -45℃ to 200℃
Hardness: 20 Shore 00
Application: CPU Memory Storage Module
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8.5W CPU Cooling Pad Thermal Conductivity Silicone Soft Thermal Pad For Memory Storage Module

8.5W CPU Cooling Pad Thermal Conductivity Silicone Soft Thermal Pad For Memory Storage Module


Ziitek TIFTM7140RUS is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


Features:
> Good thermal conductive:8.5W/MK
> Soft and compressible for low stress applications
> Available in varies thicknesses
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Heat pipe thermal solutions
> Set top boxes
> Audio and video components
> Monitoring the Power Box
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power

Typical Properties of TIFTM7140RUS Series
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Specific Gravity3.2g/ccASTM D297
thickness3.5mmTASTM D374
Hardness (thickness<1.0mm)20 (Shore 00)ASTM 2240
Continuos Use Temp-45 to 200℃******
Dielectric Breakdown Voltage>3500 VACASTM D149
Dielectric Constant5.1~6.1MHzASTM D150
Volume Resistivity1.0X10¹²Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity8.5W/m-KASTM D5470

Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.


Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

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