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2inch 3inch 4inch 6inch SiC Epitaxial Wafers 4H-N Production Grade

Categories SiC Substrate
Brand Name: ZMSH
Model Number: SiC Epitaxial Wafer
Certification: rohs
Place of Origin: CHINA
MOQ: 25
Price: by case
Payment Terms: T/T
Supply Ability: 1000pcs per month
Delivery Time: 5-8weeks
Packaging Details: Package in 100-grade cleaning room
Crystal Structure: 4H-SiC single crystal
Size: 2inch 3inch 4inch 6inch
Diameter/Thickness: Customized
Resistivity: 0.01–100 Ω·cm
Surface Roughness: <0.2 nm (Ra)
TTV: <5 µm
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2inch 3inch 4inch 6inch SiC Epitaxial Wafers 4H-N Production Grade


2inch 3inch 4inch & 6inch SiC epitaxial wafers - overview


2inch 3inch 4inch 6inch SiC Epitaxial Wafers 4H-N Production Grade

Company Profile:


As a leading SiC (Silicon Carbide) epitaxial wafer supplier, ZMSH specialize in the production, processing, and global distribution of high-quality 4H-N-type conductive and MOS-grade epitaxial wafers in 2-inch (50.8mm), 3-inch (76.2mm), 4-inch (100mm), and 6-inch (150mm) diameters, with capabilities extending up to 12-inch (300mm) for future industry demands.


Our product portfolio includes:


· 4H-N-type & 6H-N-type conductive SiC substrates (for power devices)

· High-Purity Semi-Insulating (HPSI) & SEMI-standard wafers (for RF applications)

· 4H/6H-P-type & 3C-N-type SiC wafers (for specialized semiconductor needs)

· Custom doping, thickness, and surface finishes (CMP, epi-ready, etc.)


With advanced CVD epitaxial growth technology, strict quality control (ISO 9001), and full in-house processing capabilities, we serve automotive, power electronics, 5G, and aerospace industries worldwide.



Key parameters (2inch, 3inch, 4inch, 6inch 4H-N-Type Epi Wafers)

ParameterSpecifications
Crystal Structure4H-SiC (N-type)
Diameter2" / 3" / 4" / 6"
Epi Thickness5-50 µm (custom)
Doping Concentration1e15~1e19 cm⁻³
Resistivity0.01–100 Ω·cm
Surface Roughness<0.2 nm (Ra)
Dislocation Density<1×10³ cm⁻²
TTV (Total Thickness Variation)<5 µm
Warpage<30 µm

(All specs customizable – contact us for project-specific requirements.)



Key features of 4H-N SiC epitaxial wafers


1. Superior Electrical Performance

  • SiC epitaxial wafers wide bandgap (3.2 eV) & high breakdown voltage (>2 MV/cm) for high-power devices
  • SiC epitaxial wafers low on-resistance (R<sub>on</sub>) for efficient power conversion

2. Excellent Thermal Properties

  • SiC epitaxial wafers high thermal conductivity (4.9 W/cm·K) for better heat dissipation
  • SiC epitaxial wafers stable up to 600°C+, ideal for harsh environments

3. High-Quality Epitaxial Layer

  • SiC epitaxial wafers low defect density (<1×10³ cm⁻²) for reliable device performance
  • Uniform thickness (±2%) and doping control (±5%) for consistency

4. Multiple Wafer Grades Available

  • Conductive Grade (for diodes, MOSFETs)
  • MOSFET Grade (ultra-low defects for high-performance transistors)


Primary applications of 4H-N SiC epitaxial wafers


1. Electric Vehicles (EVs) & Fast Charging

  • SiC MOSFETs & Schottky diodes for inverters and OBCs (higher efficiency than Si)

2. Renewable Energy & Industrial Power

  • Solar inverters, wind turbines, and smart grids (lower energy loss)

3. 5G & RF Communications

  • GaN-on-SiC RF devices for 5G base stations (high-frequency operation)

4. Aerospace & Defense

  • SiC epitaxial wafers can be used for Radar, satellite comms, and high-voltage systems (extreme environment stability)

5. Consumer & Industrial Electronics

  • SiC epitaxial wafers can be used for high-efficiency PSUs, motor drives, and UPS systems


ZMSH's Services of 4H-N SiC epitaxial wafers


1. Full-Cycle Manufacturing & Customization

· SiC substrate production (2" to 12")

· Epitaxial growth (CVD) with controlled doping (N/P-type)

· Wafer processing (lapping, polishing, laser marking, dicing)


2. Testing & Certification

· XRD (crystallinity), AFM (surface roughness), Hall effect (carrier mobility)

· Defect inspection (etch pit density, micropipes <1/cm²)


3. Global Supply Chain Support

· Fast prototyping & bulk order fulfillment

· Technical consulting for SiC device design


Why Choose Us?

✔ Vertical integration (substrate → epitaxy → finished wafer)

✔ High yield & competitive pricing

✔ R&D support for next-gen SiC devices

✔ Fast lead times & global logistics

(For datasheets, samples, or quotes – reach out today!)



FAQ of 4H-N SiC epitaxial wafers


1. Q: What are the key differences between 2-inch, 4-inch and 6-inch SiC epitaxial wafers?

A: The main differences are in production scalability (6" enables higher volume) and cost-per-chip (larger wafers reduce device costs by ~30%).


2. Q: Why choose 4H-SiC over silicon for power devices?

A: 4H-SiC offers 10x higher breakdown voltage and 3x better thermal conductivity than silicon, enabling smaller, more efficient power systems.


Tags: #2inch 3inch 4inch 6inch, #SiC Epitaxial Wafers, #Silicon Carbide#4H-N, #Conductive, #Production Grade, #MOS Grade


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