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Precision IC Chip Test Sockets Semiconductors High Accuracy Chip Testing Solutions

Categories IC Test Sockets
Brand Name: Sireda
Model Number: Open Top
Certification: ISO9001
Place of Origin: China
MOQ: 1
Price: Get Quote
Pitch: ≥0.3mm
Pin Count: 2-2000+
Compatible Packages:: BGA, QFN, LGA, SOP, WLCSP
Socket Type: Open Top
Conductor Type: Probe Pins, Pogo Pin, PCR
Features: Highly customizable
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Precision IC Chip Test Sockets Semiconductors High Accuracy Chip Testing Solutions

High-Performance IC Test Sockets for Reliable Semiconductor Testing

As a leading IC test socket manufacturer, we specialize in precision-engineered chip test sockets that ensure accurate and repeatable validation of integrated circuits. Our test sockets are designed for demanding applications including semiconductor production, burn-in testing, and quality control.

IC Test Socket Product Image IC Test Socket Product Image
Key Features & Benefits:
  • Superior Durability - Built for high-cycle testing with robust materials that withstand thousands of insertions
  • Broad Compatibility - Supports BGA, QFN, SOP, and other IC packages
  • Precision Contact Technology - Low-resistance spring probes or pogo pins for reliable electrical connections
  • Custom Configurations - Tailored test fixtures for unique IC designs and testing requirements
  • Thermal & High-Frequency Options - Specialized sockets for burn-in, high-temp, and RF testing
IC Test Socket Technical Image
Custom BGA Test Socket: Core Specifications
PropertyParameterTypical Value
MechanicalInsertion Cycles≥30K-50K cycles
Contact Force20-30g/pin
Operating TemperatureCommercial -40 ~ +125
Military -55 ~ +130
Tolerance±0.01mm
ElectricalContact Resistance<50mΩ
Impedance50Ω (±5%)
Current1.5A~3A

IC Test Socket Solutions - Precision Testing for Demanding Applications
Whether you're validating prototypes, programming ICs, or running high-volume production tests, our custom test sockets ensure accuracy and repeatability. Engineered for challenging environments, our sockets feature robust mechanical designs to prevent warping under thermal stress while maintaining stable contact resistance. Compatible with automated handlers and testers, they streamline your validation process while cutting downtime.

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