Heat Dissipation Semiconductor Test Socket Reliable Open Top Type

• Advanced Heat Dissipation
  Specially designed for stable operation up to 150 °C+, preventing thermal drift in power device and automotive testing.
• Extended Burn-In Durability
  Engineered for 200+ hours of continuous validation with minimal contact degradation.

• Superior Durability - Built for high-cycle testing with robust materials that withstand thousands of insertions
• Broad Compatibility - Supports BGA, QFN, SOP, and other IC packages
• Precision Contact Technology - Low-resistance spring probes or pogo pins for reliable electrical connections
• Custom Configurations - Tailored test fixtures for unique IC designs and testing requirements
• Thermal & High-Frequency Options - Specialized sockets for burn-in, high-temp, and RF testing

Whether you're validating prototypes, programming ICs, or running high-volume production tests, our custom test sockets ensure accuracy and repeatability. Engineered for challenging environments, our sockets feature robust mechanical designs to prevent warping under thermal stress while maintaining stable contact resistance. Compatible with automated handlers and testers, they streamline your validation process while cutting downtime.