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F4BTMS220 RF Copper Clad Laminate

F4BTMS220 RF Copper Clad Laminate

F4BTMS220 RF Copper Clad Laminate
F4BTMS220 RF Copper Clad Laminate
Categories Copper Clad Laminates
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Part number: F4BTMS220
Laminate thickness: 0.09mm 0.127mm 0.254mm 0.508mm 0.635mm 0.762mm 0.787mm 1.016mm 1.27mm 1.5mm 1.524mm 1.575mm 2.03mm 2.54mm 3.175mm 4.06mm 5.08mm 6.35mm
Laminate size: 18"X12"(457X305mm); 18"X24"(457X610mm); 24"X36"(610X920mm)
Copper weight: 0.5OZ（0.018mm）1OZ（0.035mm）
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Company Info.
Bicheng Electronics Technology Co., Ltd
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F4BTMS220 RF Copper Clad Laminate

The F4BTMS Series represents an advanced upgrade to the F4BTM Series. Leveraging the foundational design of its predecessor, it incorporates pivotal technological advancements in both material formulation and manufacturing processes. The material is infused with a high concentration of ceramics and reinforced with ultra-thin, ultra-fine fiberglass cloth—optimizations that deliver substantial improvements in overall performance and an expanded dielectric constant range. As a result, it qualifies as an aerospace-grade, high-reliability material capable of directly substituting for comparable foreign alternatives.
A synergistic combination of minimal ultra-thin/ultra-fine fiberglass cloth reinforcement and high-load, uniformly dispersed specialty nano-ceramics blended with polytetrafluoroethylene (PTFE) resin effectively mitigates the fiberglass effect during electromagnetic wave transmission and reduces dielectric loss. Beyond these benefits, the material exhibits enhanced dimensional stability, reduced anisotropy across the X/Y/Z axes, elevated operating frequency capabilities, improved dielectric strength, and increased thermal conductivity. It also features an excellent low coefficient of thermal expansion (CTE) and consistent dielectric properties across temperature variations.
Standard-equipped with RTF low-profile copper foil, the F4BTMS220 minimizes conductor loss while ensuring exceptional peel strength. It is compatible with both copper and aluminum substrates, and printed circuit boards (PCBs) fabricated from this material can be processed using conventional PTFE laminate manufacturing techniques. Boasting superior mechanical and physical characteristics, the laminate is well-suited for producing multi-layer, high-density multi-layer, and backplane PCBs. It also offers excellent processability for intricate manufacturing requirements such as dense via drilling and fine line patterning.

Product Features

  • Tight dielectric constant tolerance and excellent inter-batch consistency
  • Ultra-low dielectric loss
  • Stable dielectric constant and low loss values at operating frequencies up to 40 GHz, meeting the demands of phase-sensitive applications
  • Superior temperature coefficients for both dielectric constant and dielectric loss, ensuring reliable frequency and phase stability across the temperature spectrum of -55 °C to 150 °C
  • Exceptional radiation resistance; maintains stable dielectric and physical properties even after exposure to specified radiation dosages
  • Low outgassing performance; complies with aerospace vacuum outgassing requirements when tested in accordance with standard protocols for material volatility under vacuum conditions
  • Low coefficient of thermal expansion (CTE) in the X/Y/Z directions, guaranteeing dimensional thermal stability and via copper integrity
  • Enhanced thermal conductivity, making it ideal for high-power application scenarios
  • Superior dimensional stability
  • Low water absorption rate

Typical Applications

  • Aerospace equipment, including spaceborne and on-board systems
  • Microwave and radio frequency (RF) components
  • Radar systems, particularly military radar
  • Feed networks
  • Phase-sensitive antennas and phased array antennas
  • Satellite communications systems, etc.

Product FeaturesTest ConditionsUnitF4BTMS220
Dielectric Constant (Typical)10GHz/2.2
Dielectric Constant Tolerance//±0.02
Dielectric Constant (Design)10GHz/2.2
Loss Tangent (Typical)10GHz/0.0009
20GHz/0.0010
40GHz/0.0013
Dielectric Constant Temperature Coefficient-55 º~150ºCPPM/℃-130
Peel Strength1 OZ RTF copperN/mm>2.4
Volume ResistivityStandard ConditionMΩ.cm≥1×10^8
Surface ResistivityStandard ConditionMΩ≥1×10^8
Electrical Strength (Z direction)5KW,500V/sKV/mm>26
Breakdown Voltage (XY direction)5KW,500V/sKV>35
Coefficientof Thermal Expansion (X, Y direction)-55 º~288ºCppm/ºC40, 50
Coefficientof Thermal Expansion (Z direction)-55 º~288ºCppm/ºC290
Thermal Stress260℃, 10s,3 times/No delamination
Water Absorption20±2℃, 24 hours%0.02
DensityRoom Temperatureg/cm32.18
Long-Term Operating TemperatureHigh-Low Temperature Chamber℃-55～+260
Thermal ConductivityZ directionW/(M.K)0.26
Flammability/UL-94V-0
Material Composition//PTFE,Ultra-thin and ultra-fine (quartz) fiberglass.

Product Tags:

RF copper clad laminate

  

F4BTMS220 copper laminate

  

high-frequency copper clad board

  
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F4BTMS220 RF Copper Clad Laminate

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