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TLY-5 PCB Material Copper Clad Laminate

Categories Copper Clad Laminates
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Part number: TLY-5
Laminate thickness: 0.089mm 0.127mm 0.191mm 0.254mm 0.508mm 0.762mm 1.524mm 3.175mm
Laminate size: 12X18 inch, 16X18 inch, 18X24 inch, 16X36 inch, 24X36 inch, 18X48 inch
Copper weight: 0.5OZ(0.018mm)1OZ(0.035mm)
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TLY-5 PCB Material Copper Clad Laminate

TLY-5 laminates are fabricated using ultra-lightweight woven fiberglass substrates, delivering superior dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiber matrix inherent to TLY-5 imparts enhanced mechanical robustness to the laminate, rendering it well-suited for high-volume production environments. Boasting a low dissipation factor, this material is ideally engineered for 77 GHz automotive radar systems and a broad spectrum of other millimeter-wave antenna applications.


Comparative OEM validation testing conducted at 77 GHz—pitting lightly reinforced TLY-5 against its closest chopped fiber-reinforced counterpart—has verified drop-in compatibility, with equivalent insertion loss and dielectric performance metrics. The key competitive advantage lies in TLY-5’s substantially higher manufacturing yields.


TLY-5 features a dielectric constant (Dk) range of 2.17–2.40. For the majority of available thicknesses, the Dk value can be customized to any point within this interval, with a tight tolerance of ±0.02. At 10 GHz, the material exhibits a dissipation factor (Df) of approximately 0.0009, a standout performance within the low-Dk material category.



Key Benefits

  • Exceptional dimensional stability
  • Industry-leading low dissipation factor
  • High peel strength
  • Minimal moisture absorption
  • Uniform, consistent dielectric constant
  • Laser ablatable

Typical Applications

  • Automotive radar systems
  • Satellite and cellular communications infrastructure
  • Power amplifiers
  • Low-noise blocks (LNBs), low-noise amplifiers (LNAs), low-noise converters (LNCs)
  • Aerospace and avionics
  • Ka-band, E-band, and W-band systems
  • Phased array antennas and RF filters/couplers

TLY TYPICAL VALUES
PropertyTest MethodUnitValueUnitValue
DK at 10 GHzIPC-650 2.5.5.52.22.2
Df at 10 GHzIPC-650 2.5.5.50.00090.0009
Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
Dielectric BreakdownIPC-650 2.5.6kV>45kV>45
Dielectric StrengthASTM D 149V/mil2,693V/mil106,023
Volume ResistivityIPC-650 2.5.17.1(after elevated temp.)Mohms/cm1010Mohms/cm1010
Volume ResistivityIPC-650 2.5.17.1(after humidity)Mohms/cm1010Mohms/cm109
Surface ResistivityIPC-650 2.5.17.1(after elevated temp.)Mohms108Mohms108
Surface ResistivityIPC-650 2.5.17.1(after humidity)Mohms108Mohms108
Flex Strength(MD)IPC-650 2.4.4psi14,057N/mm296.91
Flex Strength(CD)IPC-650 2.4.4psi12,955N/mm289.32
Peel Stength(½ oz.ed copper)IPC-650 2.4.8Ibs./inch11N/mm1.96
Peel Stength(1 oz.CL1 copper)IPC-650 2.4.8Ibs./inch16N/mm2.86
Peel Stength(1 oz..CV1 copper)IPC-650 2.4.8Ibs./inch17N/mm3.04
Peel StengthIPC-650 2.4.8(after elevated temp.)Ibs./inch13N/mm2.32
Young's Modulus(MD)ASTM D 3039/IPC-650 2.4.19psi1.4 x 106N/mm29.65 x 103
Poisson's Ratio(MD)ASTM D 3039/IPC-650 2.4.190.210.21
Thermal ConductivityASTM F 433W/M*K0.22W/M*K0.22
Dimensional Stability(MD,10mil)IPC-650 2.4.39(avg.after bake&thermal stress)mils/inch-0.038-0.038
Dimensional Stability(CD,10mil)IPC-650 2.4.39(avg.after bake&thermal stress)mils/inch-0.031-0.031
Density(Specific Gravity)ASTM D 792g/cm32.19g/cm32.19
CTE(X axis)(25-260℃)ASTM D 3386(TMA)ppm/℃26ppm/℃26
CTE(Y axis)(25-260℃)ASTM D 3386(TMA)ppm/℃15ppm/℃15
CTE(Z axis)(25-260℃)ASTM D 3386(TMA)ppm/℃217ppm/℃217
NASA Outgassing(% TML)0.010.01
NASA Outgassing(% CVCM)0.010.01
NASA Outgassing(% WVR)0.000.00
UL-94 Flammability RatingUL-94V-0V-0

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