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High Speed DiClad 880 Copper Clad Laminate

Categories Copper Clad Laminates
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Part number: DiClad 880
Laminate thickness: 0.508mm 0.762mm 1.524mm
Laminate size: 12"X18"(305X457mm); 18"X12"(457X305mm); 18"X24"(457X610mm); 24"X18"(610X457mm);
Copper weight: 0.5OZ(0.018mm)1OZ(0.035mm)
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High Speed DiClad 880 Copper Clad Laminate

DiClad 880 laminates are woven fiberglass/PTFE composite substrates designed for printed circuit boards. By precisely controlling the fiberglass-to-PTFE ratio, these laminates provide a spectrum of options—from the lowest available dielectric constant and dissipation factor to more heavily reinforced versions with enhanced dimensional stability.


The woven fiberglass reinforcement in DiClad materials delivers superior dimensional stability compared to non-woven fiberglass PTFE laminates with similar dielectric constants. Rogers' controlled process for coating and aligning the fiberglass cloth plies enables a wider selection of dielectric constants and ensures exceptional dielectric constant uniformity.


DiClad 880 laminates are ideal for applications requiring precise electrical performance, such as filters, couplers, and low-noise amplifiers, where dielectric uniformity is essential. They are also well-suited for power dividers and combiners, where low signal loss is critical.



Features & Benefits:
- Extremely low loss tangent
- Excellent dimensional stability
- High product performance uniformity
- Stable electrical properties across frequency
- Consistent mechanical performance
- Excellent chemical resistance


Typical Applications:
- Military radar feed networks
- Commercial phased array networks
- Low-loss base station antennas
- Missile guidance systems
- Digital radio antennas
- Filters, couplers, and low-noise amplifiers (LNAs)


PropertiesDiClad 880UnitsTest ConditionsTest Method
Electrical Properties----
Dielectric Constant (10 GHz)2.17, 2.20-23˚C @ 50% RH 10 GHzIPC TM-650 [2.5.5.5](2.5.5.5)
Dielectric Constant (1 MHz)2.17, 2.20-23˚C @ 50% RH 1 MHzIPC TM-650 [2.5.5.3](2.5.5.3)
Dissipation Factor (10 GHz)0.0009-23˚C @ 50% RH 10 GHzIPC TM-650 [2.5.5.5](2.5.5.5)
Dissipation Factor (1 MHz)0.0008-23˚C @ 50% RH 1 MHzIPC TM-650 [2.5.5.3](2.5.5.3)
Thermal Coefficient of Dielectric Constant-160ppm/˚C-10 to 140˚C 10 GHzIPC TM-650 [2.5.5.5](2.5.5.5)
Volume Resistivity1.4 x 10⁹MΩ-cmC96/35/90IPC TM-650 [2.5.17.1](2.5.17.1)
Surface Resistivity2.9 x 10⁶C96/35/90IPC TM-650 [2.5.17.1](2.5.17.1)
Dielectric Breakdown>45kVD48/50ASTM D-149
Arc Resistance>180--ASTM D-495
Thermal Properties----
Coefficient of Thermal Expansion - x25ppm/˚C-50˚C to 150˚CIPC TM-650 2.4.41
Coefficient of Thermal Expansion - y34ppm/˚C-50˚C to 150˚CIPC TM-650 2.4.41
Coefficient of Thermal Expansion - z252ppm/˚C-50˚C to 150˚CIPC TM-650 2.4.24
Thermal Conductivity0.25W/(m.K)-ASTM E1461
Mechanical Properties----
Copper Peel Strength14Lbs/in10s @288˚C 35 μm foilIPC TM-650 2.4.8
Young’s Modulus267, 202kpsi23˚C @ 50% RHASTM D-638
Tensile Strength (MD, CMD)8.1, 7.5kpsi23˚C @ 50% RHASTM D-882
Compressive Modulus237kpsi23˚C @ 50% RHASTM D-695
Flex Modulus357kpsi23˚C @ 50% RHASTM D-3039
Physical Properties----
FlammabilityV-0-C48/23/50 & C168/70UL 94
Moisture Absorption0.02%E1/105+D24/23IPC TM-650 [2.6.2.2](2.6.2.2)
Density2.23g/cm³C24/23/50 Method AASTM D792
NASA Outgassing----
Total Mass Lost0.01%125°C, ≤ 10⁻⁶ torrNASA SP-R-0022A
Collected Volatiles0.01%125°C, ≤ 10⁻⁶ torrNASA SP-R-0022A
Water Vapor Recovered0.0%125°C, ≤ 10⁻⁶ torrNASA SP-R-0022A

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