TLY-5Z RF PCB Substrate Copper Clad Laminate Sheet

TLY-5Z laminates are high-performance, glass-filled PTFE composites integrated with woven fiberglass reinforcement. Engineered specifically for low-density use cases, this glass-loaded structure is optimized for weight-sensitive applications such as aerospace systems with stringent lightweight requirements.

This specialized formulation yields a dimensionally stable composite—a performance attribute unattainable with non-reinforced PTFE materials. The low-density design also endows the composite with a minimized Z-axis coefficient of thermal expansion (CTE), a characteristic that conventional PTFE-rich composites cannot replicate. Compared to standard low-dielectric-constant PTFE composites, TLY-5Z delivers far superior thermal stability, effectively mitigating Z-axis expansion-induced stress on plated through holes (PTHs).

From a cost standpoint, TLY-5Z represents a highly competitive solution. Its glass-filled architecture offers a cost-effective alternative to standard PTFE-rich copper-clad laminates, making it viable for high-volume commercial microwave applications where PTFE-dominant substrates would be economically prohibitive. TLY-5Z is uniquely suited for printed wiring board (PWB) designs that pose extreme manufacturing challenges or exhibit thermal unreliability when fabricated with traditional PTFE-rich substrates. Conventional PTFE-dominant substrates are prone to PTH drilling defects, often requiring thick copper plating to ensure basic reliability; even then, the resulting PWBs are susceptible to thermal cycle-induced cracking. By contrast, TLY-5Z features 50% lower thermal expansion than PTFE-rich substrates, boasts enhanced drillability, and demonstrates robust thermal cycling resistance. Ground stitching along transmission lines can be implemented seamlessly while maintaining long-term thermal reliability. For complex multilayer stripline designs, TLY-5Z outperforms legacy PTFE-rich substrates by a significant margin. Additionally, this material is well-suited for Substrate Integrated Waveguide (SIW) applications incorporating numerous mode-suppression vias.

TLY-5Z is fully compatible with ultra-smooth copper foils, including the latest ULP (ultra-low profile) copper foil variants. It also exhibits a reduced temperature coefficient of dielectric constant (TcK) relative to conventional materials with a dielectric constant of 2.2.

Key Benefits

• Low Z-axis coefficient of thermal expansion (CTE)
• Exceptional plated through hole (PTH) stability
• Low density (1.92 g/cm³)
• Superior price-to-performance ratio
• Excellent peel strength
• Compatibility with ultra-flat copper foils
  

Typical Applications

• Aerospace components
• Aircraft low-weight antennas
• RF passive components