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| Categories | Copper Clad Laminates |
|---|---|
| Brand Name: | Bicheng |
| Model Number: | BIC-332.V1.0 |
| Certification: | UL, ISO9001, IATF16949 |
| Place of Origin: | CHINA |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Payment Terms: | T/T |
| Supply Ability: | 5000PCS per month |
| Delivery Time: | 8-9 working days |
| Packaging Details: | Vacuum bags+Cartons |
| Part number: | IsoClad 933 |
| Laminate thickness: | 0.381mm 0.787mm 1.575mm |
| Laminate size: | 305X460mm(12X18''); 24X18''(610X457mm) |
| Copper weight: | 0.5OZ(0.018MM), 1OZ（0.035mm); |
| Company Info. |
| Bicheng Electronics Technology Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
IsoClad® 933 laminates are nonwoven fiberglass-reinforced PTFE composite materials tailored for deployment as printed circuit board (PCB) substrates. The nonwoven reinforcement architecture imparts enhanced flexural capability, making these laminates ideally suited for applications requiring post-fabrication circuit bending—conformal or “wrap-around” antennas represent a prime use case for this attribute.
Unlike standard nonwoven fiberglass/PTFE alternatives, IsoClad
series laminates incorporate longer randomly oriented fibers and
leverage a proprietary manufacturing process to deliver superior
dimensional stability and enhanced dielectric constant (Dk)
uniformity, even when compared to competitive products with
equivalent dielectric constant values.
With a dielectric constant (Er) of 2.33, IsoClad 933 laminates
utilize a higher fiberglass-to-PTFE ratio to form a highly
reinforced composite structure. This optimized formulation achieves
improved dimensional stability alongside elevated mechanical
strength, without compromising core electrical performance.
Features
Benefits
Typical Applications
| Property | Test Method | Condition | IsoClad 933 |
| Dielectric Constant @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.33 |
| Dissipation Factor @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0016 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 (Adapted) | -10°C to +140°C | -132 |
| Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal | 10 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 3.5 x 10⁸ |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.0 x 10⁸ |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 173, 147 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 6.8, 5.3 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 197 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 239 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Density (g/cm³) | ASTM D-792 (Method A) | A, 23°C | 2.27 |
| Water Absorption (%) | MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.05 |
| Coefficient of Thermal Expansion (ppm/°C) | IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer | 0°C to 100°C | X Axis: 31 |
| Y Axis: 47 | Y Axis: 35 | ||
| Z Axis: 236 | Z Axis: 203 | ||
| Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.263 |
| Outgassing Requirements | 125°C, ≤10⁻⁶ torr | - | |
| Total Mass Loss (%) | Maximum 1.00% | 125°C, ≤10⁻⁶ torr | 0.03 |
| Collected Volatile Condensable Material (%) | Maximum 0.10% | 125°C, ≤10⁻⁶ torr | 0.00 |
| Water Vapor Regain (%) | - | 125°C, ≤10⁻⁶ torr | 0.02 |
| Visible Condensate | ± | 125°C, ≤10⁻⁶ torr | NO |
| Flammability | UL 94 Vertical Burn; IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |
|
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