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High Frequency CuClad233 RF PCB Substrate

Categories Copper Clad Laminates
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Part number: CuClad233
Laminate thickness: 0.254mm 0.508mm 0.787mm 1.575mm
Laminate size: 18''X12''(457X305mm); 18''X24''(457X610mm)
Copper weight: 0.5OZ(0.018MM), 1OZ(0.035mm)
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High Frequency CuClad233 RF PCB Substrate

CuClad 233 laminates are woven fiberglass-reinforced PTFE composite materials engineered specifically for deployment as printed circuit board (PCB) substrates. Leveraging precise regulation of the fiberglass-to-PTFE ratio, CuClad 233 laminates provide a versatile product range—encompassing grades with ultra-low dielectric constant (Dk) and loss tangent, as well as highly reinforced variants optimized for enhanced dimensional stability.


The woven fiberglass reinforcement integral to CuClad series materials delivers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency over PTFE-coated fiberglass cloth not only enables a broader spectrum of available Dk values, but also yields laminates with improved dielectric constant uniformity relative to comparable nonwoven fiberglass-reinforced alternatives. These performance attributes position CuClad laminates as a high-value solution for RF filters, couplers, and low-noise amplifiers (LNAs).


A defining characteristic of CuClad 233 laminates is their cross-plied architecture: alternating layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This design achieves true electrical and mechanical isotropy in the XY plane—a proprietary feature exclusive to CuClad 233 laminates that no other woven or nonwoven fiberglass-reinforced PTFE laminates can match. This exceptional level of isotropy is critical for demanding applications such as phased array antennas.


With a dielectric constant (Er) of 2.33, CuClad 233 employs a balanced fiberglass-to-PTFE ratio that optimizes low dielectric constant and improved dissipation factor, without compromising core mechanical performance.



Features & Benefits

  • Cross-plied woven fiberglass architecture with alternating plies oriented at 90°
  • High PTFE-to-glass ratio
  • Superior dielectric constant uniformity vs. comparable nonwoven fiberglass-reinforced laminates
  • True electrical and mechanical isotropy in the XY plane
  • Ultra-low signal loss
  • Ideal for dielectric constant (Er)-sensitive circuit designs


Typical Applications

  • Military electronics systems (radars, electronic countermeasures [ECM], electronic support measures [ESM])
  • Microwave components (low-noise amplifiers [LNAs], filters, couplers, etc.)

PropertyTest MethodConditionCuClad 233
Dielectric Constant @10 GHzIPC TM-650 2.5.5.5C23/502.33
Dielectric Constant @1MHzIPC TM-650 2.5.5.3C23/502.33
Dissipation Factor @10 GHzIPC TM-650 2.5.5.5C23/500.0013
Thermal Coefficient of Er (ppm/°C)IPC TM-650 2.5.5.5 Adapted-10°C to +140°C-161
Peel Strength (lbs.per inch)IPC TM-650 2.4.8After Thermal Stress14
Volume Resistivity (MΩ-cm)IPC TM-650 2.5.17.1C96/35/908.0 x 10 8
Surface Resistivity (MΩ)IPC TM-650 2.5.17.1C96/35/902.4 x 10 6
Arc Resistance (seconds)ASTM D-495D48/50>180
Tensile Modulus (kpsi)ASTM D-638A, 23°C510, 414
Tensile Strength (kpsi)ASTM D-882A, 23°C10.3, 9.8
Compressive Modulus (kpsi)ASTM D-695A, 23°C276
Flexural Modulus (kpsi)ASTM D-790A, 23°C371
Dielectric Breakdown (kv)ASTM D-149D48/50> 45
Specific Gravity (g/cm3)ASTM D-792 Method AA, 23°C2.26
Water Absorption (%)MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2E1/105 + D24/230.02

Coefficient of Thermal Expansion (ppm/°C)

X Axis

Y Axis

Z Axis

IPC TM-650 2.4.24 Mettler 3000

Thermomechanical Analyzer

0°C to 100°C

23

24

194

Thermal ConductivityASTM E-1225100°C0.26

Outgassing

Total Mass Loss (%)

Collected Volatile

Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±)

NASA SP-R-0022A

Maximum 1.00%

Maximum 0.10%

125°C, ≤ 10-6 torr

0.01

0.01

0.00

NO

FlammabilityUL 94 Vertical Burn IPC TM-650 2.3.10C48/23/50, E24/125Meets requirements of UL94-V0

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